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Applications and  Additional Products

Modification of Superwood components allows the development of other major applications. A lighter-weight product to replace metal panels for automobiles is now under development by Ford Motor Company and Toyota. We can make a stronger and less expensive material with our technology. We intend to manufacture graphene, nanocellulose and resins in-house to control our costs and to be a commercial source for these materials. In addition, other products similar to  automotive exist in sporting goods, aircraft interiors, ships, and vessels to cite a few. The products that we have developed or have an interest in developing are:   

Composites, Our issued Patent for armor products also claims enhancements made to other reinforcing fibers and fabrics. The patented method claims include the manufacturing of fiber-reinforced composites having graphene; graphene nanoribbons and/or carbon nanotubes covalently bonded to fibers to enhance physical properties.

Conductive Ink, an accidental discovery!  A formulated ink was placed on a higher-temperature hotplate for curing which made the silver ink cold-weld reducing the resistivity to near the property of pure silver. This product was sold to Dow Corning. Modifying this product with graphene we can make the ink more conductive and lower cost.

Metal Matrix Composites,  Titanium, and Aluminum are reactive with carbon producing Carbides when heated to melt temperatures preventing the manufacture of Metal Matrix Composites. A new technology, ultrasonic consolidation, is capable of welding metals at less than half of the melting temperature, by utilizing ultrasonic vibrations to remove surface oxide and “cold weld” the metals allowing embedding of carbon reinforcement to make the composites. We have a Patent Pending

Printed Circuit Boards. With chip production returning to the USA and Electric Vehicle (EV) development, there is a significant need for North American manufacture of next-generation PCBs with sustainable materials by using modified Susperwood. These will be molded with the circuit graves and through holes molded in and conductive ink squeezed into the substrate.

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